Bond University enjoys an exciting student exchange agreement with one of the most highly regarded universities in China, Tsinghua University in Beijing, China.
About the Grant
Launched by benefactor Denis Jen, the grants have made it possible for several students a year from both Bond and Tsinghua Universities to gain valuable educational and cultural insights from these exchange scholarships. The exchange scholarships also enable Bond University to develop and maintain close relationships with this prestigious institution, and align Bond with other universities of world standing. Students who receive the travel exchange scholarships also become ambassadors for their home university, sharing what they have learned through presentations to their peers about their international university experience.
Availability
Two Tsinghua University Travel Scholarships are awarded each year.
Eligibility & Selection Criteria
If you are enrolled full time in the MBA program at Bond, you will be eligible to apply for an outgoing exchange place and automatically included in the grant application process to attend Tsinghua University.
